Bell System Technical Journal, v51: i1 January 1972
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Table of Contents
Page(s) | Article Title | Author(s) |
1-21 | Soil Burial Tests: Soil Burial of Materials and Structures | Connolly, R.A. |
23-42 | Soil Burial Tests: Effect of Soil Burial Exposure on the Properties of Molded Plastics | Miner, R.J. |
43-46 | Soil Burial Tests: Effect of Soil Burial Exposure on the Properties of Casting Resins | Ventrice, F.X. |
47-49 | Soil Burial Tests: Effect of Soil Burial Exposure on the Properties of Electrical Grade Reinforced Plastic Laminates | Kwei, T.K. |
51-62 | Soil Burial Tests: Effect of Soil Burial Exposure on the Properties of Structural Grade Reinforced Plastic Laminates | Klein, T.H. |
63-86 | Soil Burial Tests: Effect of Soil Burial Exposure on the Properties of Plastics for Wire and Cable | DeCoste, J.B. |
87-121 | Soil Burial Tests: Effect of Soil Burial Exposure on the Properties of Rubber, Crosslinked Polyethylene, and Vulcanized Wire Coatings | Bebbington, G.H. |
123-149 | Soil Burial Tests: Effect of Soil Burial Exposure on the Properties of Adhesives and Pressure-Sensitive Tapes | Dahringer, D.W. |
151-163 | Soil Burial Tests: Trends in Material Behavior After Eight Years of Soil Exposure | Connolly, R.A. |
165-207 | Waiting Time Jitter | Duttweiler, D.L. |
209-228 | Coupled Line Equations with Random Coupling | Morrison, J.A.; McKenna, J. |
229-237 | Derivation of Coupled Power Equations | Marcuse, D. |
239-259 | Buffering of Data Generated by the Coding of Moving Images | Limb, J.O. |
261-289 | Buffer and Channel Sharing by Several Interframe Picturephone Coders | Haskell, B.G. |
291-300 | Optimal Test Point Selection for Sequential Manufacturing Processes | Garey, M.R. |
301-316 | The General Second-Order Twin-T and Its Application to Frequency-Emphasizing Networks | Lueder, E. |
317-320 | Contributors to this Issue | |
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